The MCF includes a complete facility for transmission and surface specimen preparation. Supporting the specimen preparation for transmission electron microscopy are three Gatan Precision Ion Polishing machines, four dimpling machines, and an electro-polishing system. Surface preparation for scanning electron microscopy specimens includes high vacuum sputter coating and ion etching equipment. For advanced sample preparation, the The NovaLab 600 Dual Beam, Focused Ion Beam and Field Emission Scanning Electron Microscope, is available.
Allied Multiprep Polishing System – 8”
- Precise semiautomatic polishing for a wide range of materials for microscopic (optical, SEM, TEM) imaging
- Capability for parallel polishing, angle polishing, or site-specific polishing
- Dual micrometers enabling quantifiable material removal monitored in real time
- Variable rotation and oscillation speeds
- Adjustable load control
Fischione Model 110 Automatic Twin-Jet Electropolisher
- Electrolytic polishing or chemical etching
- Simultaneous two-sided polishing
- No induced artifacts
- Adjustable flow rate, jet and specimen positions
Buehler EcoMet 250 Grinder-Polisher
- Manual polishing for a wide range of materials
- Wide array of polishing mediums available
- 8” platen size, 10-500 rpm speed, clockwise or counterclockwise
Buehler IsoMet 1000 Precision Saw
- Precision sectioning saw for cutting a variety of materials with minimal deformation
- Gravity fed cutting force
- RPM ranges from 100-975
- Table saw attachment for precision sample alignment
Gatan Precision Ion Polisher (PIPS) II
- X,Y stage permits alignment of argon beam to region of interest on the sample
- Argon ion milling with voltages between 0.1 to 8kV
- Liquid nitrogen cooling available
- Variable ion gun angles ±10°
- Touch screen for display and control of parameters
- Digital optical image with image storing and analysis in DigitalMicrograph software
Fischione Model 1020 Plasma Cleaner
- Cleans samples with high-frequency Argon/Oxygen plasma
- Simultaneously cleans TEM and SEM specimens and specimen holders
- Removed existing carbonaceous contaminations and prevents further contamination
- No material etching or sputtering
EMS Q300T D Plus Dual Target Sequential Sputtering System
- Suitable of sequential sputtering of two materials
- Fully automated with user defined recipes
- User controlled pumping sequence, number of sputter cycles, time, and current
- Adjustable stage allowing for various sample sizes and geometries
- Film thickness monitor for precise thickness control
- Interchangeable sputtering targets including gold, platinum, carbon, chromium, nickel, etc
