Handheld electrospray delivery of next-generation soy protein wound dressings for compromised wounds

PI: Phil Campbell

University:  Carnegie Mellon University

Industry Partner: NeuEsse Inc.

Soy proteins have recently been explored as a "green" renewable source biomaterial for biomedical applications. Soy protein isolate (SPI) represents an inexhaustible source material for all practical concerns. SPI-based materials improve wound healing in cutaneous wound healing and are biodegradable, allowing for subsequent applications directly onto the prior applied materials. However, the inclusion of exogenous sourced therapeutics, such as growth factors (GFs) and extracellular vesicles (EVs), will likely be required to overcome the compromised wound environment, such as in diabetic patients. This project will incorporate GFs and EVs into the SPI inks for the recently developed hand-held electrospray applicator gun designed to print OmegaSkinTM directly onto the wound site. We will assess the retention of GFs and EVs in the electroprinted materials as well as their biological activity potential toward the promotion of compromised wound healing. We will target NIH SBIR/STTR and DOD for follow on funding opportunities.