Development of high temperature adhesives using hybrid nanoparticles

Lead University: Lehigh University
PI: Raymond A. Pearson, Department of Materials Science and Engineering
Co-PI(s): Mohamed El-Aasser, Department of Chemical Engineering
PA Industry: ElectroChemical Company

The goal of this project is to develop a room temperature cured epoxy-based adhesive for high temperature use. The epoxy should have sufficient fracture resistance and ductility to allow use in demanding engineering applications. The key technological enabler in the proposed work is the development of novel hybrid nanoparticles as novel toughening agents for epoxy resins. The performance of these new types of modifiers will be compared to various hybrid nanocomposite formaulations based on commercially available toughening agents.